Dynamic Tuning is configured by system manufacturers dynamically optimizing the processor power based on the current platform thermal and power delivery conditions.
The Intel Dynamic Tuning (DTT) is recommended for performance improvement in mobile platforms. This is good because the last version didn’t actually officially support Kaby Lake. Intel power gadget mavericks windows#
Implementation of Intel® Turbo Boost Technology 2.0 only requires configuring PL1, PL1, Tau and PL2. Intel Power Gadget has finally been updated, to version 3.5 on both Windows and macOS, as of December 22, 2017. 
Turbo Time Parameter (Tau): An averaging constant used for PL1 exponential weighted moving average (EWMA) power calculation. Power Limit 4 (PL4): A limit that will not be exceeded, the PL4 power limiting algorithms will preemptively limit frequency to prevent spikes above PL4. Common use of Intel Power Gadget is to monitor energy usage of the processor Provides processor power (Watts), temperature (Celsius) and frequency (MHz) in real-time via graph displayed in the GUI. Power Limit 3 (P元): A threshold that if exceeded, the P元 rapid power limiting algorithms will attempt to limit the duty cycle of spikes above P元 by reactively limiting frequency. Intel Power Gadget is a software-based power-usage monitoring tool enabled for 2nd-generation Intel Core processors or later. Power Limit 2 (PL2): A threshold that if exceeded, the PL2 rapid power limiting algorithms will attempt to limit the spike above PL2. PL1 should not be set higher than thermal solution cooling limits. in terminal and watch output: If CPUSpeedLimit is less than 100 at some moments, then it means CPU is throttled. Power Limit 1 (PL1): A threshold for average power that will not exceed - recommend to set to equal Processor Base Power (a.k.a TDP). To monitor throttling, you may run: pmset -g thermlog. The package power control settings of PL1, PL2, P元, PL4, and Tau allow the designer to configure Intel® Turbo Boost Technology 2.0 to match the platform power delivery and package thermal solution limitations.
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